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180 degree dual row wafer connector with 1.0mm pitch vertical mounting style SMT type A1003WVA

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RULETEAM CONNECTION TECHNOLOGY (SHENZHEN) CO.,LTD

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180 degree dual row wafer connector with 1.0mm pitch vertical mounting style SMT type A1003WVA

Brand Name : HRT

Model Number : A1003WV-S-2*NP

Certification : ISO9001/ ISO14001/UL/RoHS/REACH

Place of Origin : Dongguan, China(mainland)

MOQ : 5000 pcs

Price : USD0.001 to 0.005 per pcs

Payment Terms : TT, Western Union, PayPal, L/C

Supply Ability : 28 million pcs per month

Delivery Time : 5 to 8 working days after payment checked

Packaging Details : Tube(pipe) with outside paper carton

Color : Light-yellow

Pitch : 1.0mm

Wafer materials : PA6T, UL94V-0

Wire range : AWG32# to 28#

Packaging Type : Tube

Suitable housing : A1003 series dual row

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1, Detailed specification of product:

1.Basic information:

Color: Light-yellow
Pitch: 1.00mm
Circuits: 16/20/30/32/40/50positions
Insulation O.D.: 0.80mm
Pin materials: Phosphor Bronze or gold flash
Solder tabs: Brass/Gold flash
Wafer material: Nylon6T,UL94V-0
Cap:Nylon6T,UL94V-0
Matched housing: A1003 series dual row
Mounting type: SMT
Application: Signal, wire to board
Terminal materials: Phosphor bronze
Finish terminal: Tin-plated or gold-flash type
Terminal Package: 15K pcs/reel
Terminal processing method: E-stamping before tin-plated

2. Electrical characteristic:

Current Rating: 1A AC DC
Voltage Rating: 50V AC, DC
Contact Resistance: 20mΩ Max
Insulation Resistance: 100mΩ
Withstanding Voltage: 250V AC/minute

3. Mechanical characteristic:

Temperature Range:-25°C ~+85°C
Terminal Insertion Force: 0.50kgf (Max.)
Terminal/Housing Retention Force: 0.50kgf (Min.)
Pin Retention Force: 0.30kgf (Min.)

Other detailed data please check the pictures as below.

2, Introduction for this series products

Please kindly notice these series product, you can buy it as a set, then we will offer you reasonable price.

A1003 series product
Terminal	A1003-T

Housing	Dual housing	A1003H-2XNP
	Single housing	A1003H-NP

Wafer	Dual rows type	A1003WV-S-2XNP & A1003WVA-S-2XNP

3,Corresponding engineering drawing & test report

Below file is our engineering drawing and testing report for further information. It's sure that it will be a

good reference for you to know this series parts clearly.

Drawing of dimension

180 degree dual row wafer connector with 1.0mm pitch vertical mounting style SMT type A1003WVA

4, Testing report

1. Scope

This specification covers the requirements for product performance of 1.00mm pitch wire to board

connectors series.

2. Construction,Dimensions,Material & Plating

See the attached drawings

3. Ratings & Applicable Wires

Item	Standard
Rated Voltage (Max.)	50V AC/DC		Insulation O.D. 0.80mm (Max.)
Rated Current (Max.) And Applicable Wires	AWG#28	1A AC/DC
	AWG#30	1A AC/DC
	AWG#32	0.8A AC/DC
Ambient Temperature Range	-25℃ ~ +85℃*

*: Including terminal temperature rise

4. Electrical Performance

Test Description		Procedure	Requirement
4-1	Contact Resistance	Mate connectors, measure by dry circuit, 20mV max., 10mA.(Based upon JIS C5402 5.4)	20mΩ (Max.)
4-2	Insulation Resistance	Mate connectors, apply 500V DC between adjacent terminal or ground. (Based upon JIS C5402 5.2/MIL-STD-202 Method 302 Cond. B)	100MΩ (Min.)
4-3	Dielectric Withstanding Voltage	Mate connectors, apply 250V AC (rms) for 1 minute between adjacent terminal or ground. (Based upon JIS C5402 5.1/MIL-STD-202 Method 301)	No Breakdown.
4-4	Contact Resistance on Crimped Portion	Crimp the applicable wire on to the terminal, measure by dry circuit, 20mV (Max.)., 10mA.	5mΩ (Max.)

5. Mechanical Performance

Test Description		Procedure	Requirement
5-1	Actuator Insertion & Withdrawal Force	Insert and withdraw connectors at the speed rate of 25±3mm / minute.	Refer to paragraph 7
5-2	Crimping Pull Out Force	Fix the crimped terminal, apply axial pull out force on the wire at the speed rat of 25±3mm / minute.(Based upon JIS C5402 6.8)	AWG#28	1.0kgf (Min)
			AWG#30	0.5kgf (Min)
			AWG#32	0.3kgf (Min)
5-3	Terminal Insertion Force.	Insert the crimped terminal into the housing.	0.50kgf (Max.)
5-4	Terminal/Housing Retention Force.	Apply axial pull out force at the speed rate of 25±3mm / minute on the terminal assembled in the housing.	0.50kgf (Min.)
5-5	Pin Retention Force	Apply axial push force at the speed rate of 25±3mm / minute	0.30kgf (Min.)
5-6	Durability	When mated up to 50 cycles repeatedly by the rate of 10 cycle per minute.	Contact Resistance 40mΩ (Max.)
5-7	Vibration	Amplitude: 1.5mm P-P Sweep time: 10-55-10 Hz in 1 minute Duration: 2 hours in each X.Y.Z. axes. (Based upon MIL-STD-202 Method 201A)	Appearance No Damage. Contact Resistance 40mΩ (Max.) Discontinuity 1 μsec.(Max.)
5-8	Physical Shock	490m/s²｛50G｝,3 strokes in each X.Y.Z. axes. (Based upon JIS C0041/MIL-STD-202 Method 213B Cond. A)

6. Environmental Performance And Others

Test Description		Procedure	Requirement
6-1	Temperature Rise	Carrying rated current load.(Based upon UL 498)	30℃(Max.)
6-2	Heat Resistance	85±2℃,96 hours (Based upon JIS C0021/MIL-STD-202 Method 108A Cond. A)	Appearance No Damage. Contact Resistance 40mΩ (Max.)
6-3	Cold Resistance	-25±3℃,96 hours (Based upon JIS C0020)	Appearance No Damage. Contact Resistance 40mΩ (Max.)
6-4	Humidity	Temperature: 40±2℃ Relative Humidity : 90~95% Duration: 96 hours (Based upon JIS C0022/MIL-STD-202 Method 103B Cond. B)	Appearance No Damage. Contact Resistance 40mΩ (Max.) Insulation Resistance 10MΩ (Min.) Dielectric Withstanding Voltage Must meet 4-3
6-5	Temperature Cycling	5 cycles of: a) -55℃ 30 minutes b) +85℃ 30 minutes (Based upon JIS C0025)	Appearance No Damage. Contact Resistance 40mΩ (Max.)
6-6	Salt Spray	Tin-plated 12 hours / Gold- plated 24 hours exposure to a salt spray from the 5±1% solution at 35±2℃. (Based upon JIS C0023/MIL-STD-202 Method 101C Cond. B)
6-7	SO2 Gas	24 hours exposure to 50±5ppm. SO2 gas at 40±2℃.
6-8	NH3 Gas	40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution.

6-9

Solderability

Soldering Time: 5±0.5 sec.

Solder Temperature: 245±5℃

Solder Wetting 95% of immersed area must show no voids, pin holes

6-10

Resistance to Soldering Heat

When reflowing

Refer to paragraph 8

Solder iron method

Soldering Time: 5±0.5 sec.

Solder Temperature: 370℃ ~ 400℃

Appearance No Damage.

7. Actuator Insertion/Withdrawal Force

[Unit : kgf]

Circuits	At Initial
Circuits	Insertion (Max.)	Withdrawal (Min.)
Single	0.20	0.03
2X08	3.40	0.49
2X10	4.00	0.55
2X15	5.50	0.70
2X16	5.80	0.73
2X20	7.00	0.85
2X25	8.50	1.00

Product Tags:

Wafer Connector 2.0mm

Housing Connector

180 degree dual row wafer connector with 1.0mm pitch vertical mounting style SMT type A1003WVA Images

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